PROGRAM SCHEDULE

ISSM2014 Abstracts (as of Nov 20)

Tuesday, December 2

Tue, Dec 2 | Wed, Dec 3 | Interactive

Century Room A+B

8:00 Registration
9:00 Opening
9:20 Keynote Speech
"TSMC perspective on 3D packaging trend and solutions"

Dr. Cliff Hou, Vice President, Research & Development / Design and Technology Platform, TSMC
10:00 Keynote Speech
"Hitachi's Social Innovation Business"

Akihiko Tobe, General Manager, Social Innovation Business Project Division, Hitachi, Ltd.
10:40 Break
10:50 Keynote Speech
"Application of power semiconductors to railway field as a forerunner of finding answers of emerging issues"

Prof. Tomoki Watanabe, Tokyo Institute of Technology/JR East
11:40 Lunch
12:40 Highlight Session : Big Data
Session Keynote
"Issues of Big Data in Toshiba S&S Company"

Akio Oka, Toshiba
13:20 Break

Century Room A : Highlight Session : Big Data

13:30 MC-66 : Development of robot fault detection system
YUSUKE MUKAE, Renesas Semiconductor Manufacturing
13:50 PC-15 : Advanced Semiconductor Manufacturing Using Big Data
Shinji Inoue, Panasonic
14:10 PC-50 : Development of intelligent pad and application to analysis of pressure distribution on polishing pad in CMP process
Jaehong Park, Nitta Haas Incorporeted
14:30 Author's Interview & Break
14:50 PC-20 : Modeling Abnormal Apparatus by Trouble-Based FDC
Hiroshi Matsushita, Toshiba
15:10 PC-68 : Understanding and Controlling Semiconductor Manufacturing Variability: A SEMATECH Mission
Satyavolu S. Papa Rao, SEMATECH
15:30 Author's Interview & Break
15:50 PO-2 : Pattern-independent PMD layer planarization by controlling its volume before CMP
Tomoyasu Kakegawa, SanDisk Limited
16:10 PO-17 : Failure measures for W-CMP process
Hiroshi Shibayama, Toshiba
16:30 YE-69 : Measurement and Control of Nanodefects in Liquids
Micheal Lercel, SEMATECH
16:50 Author's Interview & Networking Session
17:10
-
19:00
Reception & Networking Session

Century Room B : PO-1 & MS/MC/PE Session

13:30 PO-36 : Variability Improvement of Electrical Characteristics in MOSFETs with High-k HfON Gate Insulator by Si Surface Flattening
Shun-ichiro Ohmi, Tokyo Institute of Technology
13:50 PO-44 : Effect of Plasma Process for Sidewall SiO2 film
Tatsuhiko Tanimura, Tokyo Electron
14:10 PO-35 : Investigation of metal residue on sidewall spacer in NiPt silicide process
Takashi Tonegawa, Renesas Semiconductor Manufacturing
14:30 Author's Interview & Break
14:50 MS-24 : Measurement of vibration amplification characteristics of installed semiconductor equipment
Kaori KOMODA, Taisei Corporation
15:10 MS-23 : The Semiconductor Parts Refurbishment Operation Efficiency Optimization
Kai Lun Lin, UMC
15:30 Author's Interview & Break
15:50 MC-3 : Development of Wafer Transfer Simulator based on Cellular Automata
Hiroe Watanabe, TowerJazz Panasonic Semiconductor
16:10 MC-32 : Daily Target Setting with Inclusion of Induced Variability
Yu-Ting Kao, National Taiwan University
16:30 PE-62 : An Actinic Blank Inspection tool for EUVL HVM
Hidehiro Watanabe, EUVL Infrastructure Development Center (EIDEC)
16:50 Author's Interview & Networking Session
17:10
-
19:00
Reception & Networking Session

Wednesday, December 3

Tue, Dec 2 | Wed, Dec 3 | Interactive

Century Room A+B

8:30 Registration
9:00 Opening
9:10 ISSM Panel Discussion
10:00 Keynote Speech
"200mm Opportunities and Challenges in New Era"
Leuh Fang, President, Vanguard International Semiconductor Corporation
10:40 Highlight Session : Power Device
Invited Talk
"Progress in SiC Power Devices and Manufacturing Technology"

Prof. Tsunenobu Kimoto, Kyoto University
11:20 Break
11:30 3miniutes Summary presentation by Interactive Poster Speaker
12:20 Lunch
13:20 Invited Talk
"Intelligent Sampling Decision Scheme Based on the AVM System"

Prof. Fan-Tien Cheng, National Cheng Kung University

Century Room A : YE Session

14:10 YE-9 : Carrier Profiling Technology in 10 Nanometers Devices
Jun Hirota, Toshiba
14:30 YE-37 : Recoil Particle Elimination from Turbo Pump
Eiichi Sugawara, Tokyo Electron Miyagi
14:50 YE-27 : Particles Transport in Etching Chamber with Coulomb Force
Masaki Ishiguro, Hitachi High-Technologies
15:10 YE-16 : Yield Enhancement in MEMS Wafer Level Fabrication by Whole Process PLS Model
Tomohiro Yoshimura, OMRON
15:30 Author's Interview & Break
15:50 YE-57 : Impact of Root Cause" Identification of Parametric Failure by Using Equipment Data in CMOS Image Sensor"
Takatoshi Yasui, TowerJazz Panasonic Semiconductor
16:10 YE-51 : Voltage Contrast Detection for Challenge Systematic Killer Defects on Advanced High Voltage and CMOS Image Sensor Device
Luke Lin, HMI (TSMC)
16:30 YE-61 : Impact of Plasma Induced Charging from Implanter and ESC Dechuck process in wafer Fabrication
Dr. Mai Zhihong, Global Foundries
16:50 YE-40 : Scan Chain Design-Based Defect Inspection Approach for Faster Scan Chain Yield Ramp
Dr. Jeffrey Lam, Global Foundries
17:10 Author's Interview & Break
17:30
-
19:00
Poster Session & Awards

Century Room B : PC session / PO-2 Session

14:10 PC-25 : Correlational study between SiN etch rate and plasma impedance in electron cyclotron resonance plasma etcher for advanced process control
Takeshi Ohmori, Hitachi
14:30 PC-30 : Enhancement of Virtual Metrology Performance for Plasma-Aided Processes by Using Process Plasma Monitoring
Seolhye Park, Seoul National University
14:50 PC-39 : Use of Traditional Approaches in the Three-dimensional Integrated Circuit TSV Package Failure Analysis
Dr. Jeffrey Lam, Global Foundries
15:10 PC-21 : Defect Classification Solution for 1X nm DR using an Unpatterned Wafer Inspection System
Manjunath Prakash Kini , KLA-Tencor
15:30 Author's Interview & Break
15:50 PO-12 : Optimization Method for CVD Chamber Cleaning
Masayuki Takata, Toshiba
16:10 PO-19 : Defect reduction by reducing wafer charging
Tomohisa Satoh, Toshiba
16:30 PO-42 : negative-tone imaging process and materials with EUV exposure
Toru Fujimori, EUVL Infrastructure Development Center (EIDEC)
16:50 PO-46 : A Theoretical Modeling of Rate Enhancer for Si CMP
Akira Endou, FUJIMI INCORPORATED
17:10 Author's Interview & Break
17:30
-
19:00
Poster Session & Awards

3-min Summary Presentation by Interactive Poster Speakers

Tue, Dec 2 | Wed, Dec 3 | Interactive

Century Room A+B

11:30 Introduction of 3mins summary presentation
MS-13 : Analytical Approach for Semiconductor Production Line Control
Kohei Nyui, Shigeta Kuninobu, Toshiba
PE-34 : Robustness improvement of inline optical metrology system
Hideaki Abe, Toshiba
PO-10 : Method to achieve high selectivity and precise etching uniformity control for gas phase etching system
Tatsuya Suzuki, Tokyo Electron Limited (TSMC)
PO-48 : EUVL resist pattern formation analysis during development: in situ analysis using HS-AFM
Motoharu Shichiri, EUVL Infrastructure Development Center (EIDEC)
YE-26 : Yield prediction method of product with a redundant circuit
Hideki Yasui, Toshiba
YE-53 : The new method developed by the correlation method of monitoring minute particles in space
Ryunosuke Arita, Kumamoto University
YE-70 : A Study of Photovoltaic Electrochemical and Galvanic Effect from CMP and Clean process on Semiconductor process yield
Dr. Mai Zhihong, Global Foundries
UC-29 : Particle Reduction by Controlling Wafer Voltages in Vacuum Transfer Chamber
Tomoyuki Tamura, Hitachi High-Technologies
UC-45 : Effective proposal for the resist outgassing test on the EUV lithography
Isamu Takagi, EUVL Infrastructure Development Center (EIDEC)
UC-18 : Particle removal force measurement from the Si substrate by atomic force microscopy
Shigeru Kawamura, Tokyo Electron
UC-38 : Aerosol Cleaning with liquid droplets for super fine surface on chamber parts
Hidefumi Matsui, Tokyo Electron
PC-8 : Practical and high-speed load impedance monitoring system for anomaly detection in plasma processing
Yuji Kasashima, National Institute of Advanced Industrial Science and Technology(AIST)
PC-63 : Performance of VM Models Based on PCR and Sensitivity Test for Oxide Etch Process in triple frequency CCP
Yunchang Jang, Seoul National University
PC-55 : Secure Remote Connectivity and Big Data
Stuart Perry, ILS Technology
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