CALL FOR PAPERS
ISSM2016 paper submission has been closed.
English(PDF: 132 KB)
Japanese(PDF: 243 KB)
Important Date
- Abstract Submission Start
- Mon., Jun. 20, 2016
- Abstract Submission Due
- Friday, September 23, 2016
Thursday, August 25, 2016 - Notification of Paper Acceptance
- Thursday, October 13, 2016
Monday, September 26, 2016
ISSM 2016 Abstract Template
ISSM 2016 Abstract Template
Areas of Interest
Abstract will be accepted for each of following areas of interest. See reverse for further.
Fab Management
- Factory Design & Automated Material Handling (FD)
- Manufacturing Strategy and Operation Management (MS)
- Manufacturing Control and Execution (MC)
- Environment, Safety and Health (ES)
Process Integration
- Process and Material Optimization (PO)
- Yield Enhancement Methodology (YE)
- Contamination Control and Ultraclean Technology (UC)
- Process Control and Monitoring (PC)
- Process and Metrology Equipment (PE)
- Design for Manufacturing (DM)
Final Manufacturing
- Final Manufacturing (FM)
-Printed Electronics
-3DIC / Modules
ISSM Best Papers for IEEE/TSM
Best papers for ISSM will have the chance to submit full papers for IEEE/TSM (Transactions on Semiconductor Manufacturing) which is published quarterly for worldwide distribution. About ten papers are annually selected and reported in ISSM/TSM special session.
ISSM Awards
The following ISSM Awards to be presented to the excellent papers:;
- ISSM 2016 Best Paper Awards
- ISSM 2016 Best of the Best Paper Award
- ISSM 2016 Student Paper Awards
For detail, please see ISSM website.
Highlighted Theme
Papers on the topics of special interests will be rearranged and will be programmed as a special session for highlight themes. Papers on the following topics are especially welcome. See information on the reverse side.
High reliability device process technology for automotive and medical applications
- Technology for an effective screening
- Technology for an Outlier screening
- Rapid failure analysis for an incident
IoT and Big Data Solution
- Big Data Application
- Big Data and Sensing Technology
- Big Data and Artificial Intelligence
3D-Architecture and Modules
- Technology for Wafer on Wafer
- Technology for FOWLP (Fan Out Wafer Level Package)
- Technology for Camera Module
- Technology for MEMS and Sensors
- Technology for WiFi and Bluetooth modules
Power Devices
- Performance Improvement Technology
- Break-through Technology
- SiC Manufacturing Technology
Production Innovation in 200-mm Fabs
- Optimization of legacy fab
- Fab management and utilization of 200mm fab
e-Manufacturing & Design Collaboration
ISSM 2016 addresses the approach from design perspective to manufacturing through our collaboration with eMDC.
Details for the Areas of Interest
FAB MANAGEMENT
FD: Factory Design & Automated Material Handling
This area focuses on fab design and its key enablers to meet the flexibility, extendibility, and scalability needs of a cost-effective leading-edge fab.
MS: Manufacturing Strategy and Operation Management
This area focuses on strategy and concepts for more functional fab, and its operation management to meet rapidly changing complex business requirements.
MC: Manufacturing Control and Execution
This area includes manufacturing execution and decision support systems, factory scheduling, control of equipment/materials handling systems and queue time management.
ES: Environment, Safety and Health
This area focuses on suppression of energy and materials consumption, recycling and reuse of materials from the standpoint of the environmental management in a semiconductor factory.
Process Integration
PO: Process and Material Optimization
This area focuses on process and material optimization from the standpoint of high reliability, cost reduction and environment. The breakthrough technology to improve the productivity of legacy process is contained.
YE: Yield Enhancement Methodology
This area focuses on probe yield enhancement and its stabilization technology including inspection, analysis and reduction of defects and particles. Reports for the Zero-Defect process would be especially attractive.
UC: Contamination Control and Ultraclean Technology
This area focuses new technology on damage-less particle removal, contamination control of wafer backside and bevel, surface cleaning for new materials and fine structure. Energy saving cleaning and molecular level contamination control in advanced wafer fab will be included.
PC: Process Control and Monitoring
This area focuses on tighter process control for advanced production as well as mature fab, to achieve higher productivity, higher uptime, quality enhancement by advanced equipment control/advanced process control (AEC/APC), FDC, e-diagnostics and new sensors. This area also covers accuracy enhancement and smart process control using virtual metrology for advanced nanoscale device manufacturing, 3D profile/high aspect ratio structure control and excursion control for stable equipment operation.
PE: Process and Metrology Equipment
This area focuses on finer pattern delineation/control. The application of equipment control and engineering system will be highlighted.
DM: Design for Manufacturing
This area focuses in the collaboration between manufacturing and design including RET, OPC, systematic defects, and other approach to improve productivity from design.
Final Manufacturing
FM: Final Manufacturing
This area focuses on the technologies for "3DIC such as Wafer on Wafer and chip on wafer", "FOWLP = Fan Out Wafer Leel Package","Modules such as Camera, WiFi, Bluetooth ", "Sensors such as gyroscope and MEMS"
Details for the highlight Theme
High reliability device process technology for automotive and medical applications
Semiconductor industry considers automotive and medical devices as growing markets. These markets require superior reliability, which makes improving device reliability essential.
Semiconductor manufacturing technology for highly reliable devices shall be the key to revive semiconductor industry. ISSM would like to share the cases of process and testing technology and discuss how to achieve the goal for highly reliable devices.
Topics may includes丗
-Technology for an effective screening
-Technology for an Outlier screening
-Rapid failure analysis for an incident
IoT and Big Data Solution
IoT, 乬Big Data乭, Industry 4.0 have been studied in various industries recently. The semiconductor fabs have been recognized as one of the most heavily instrumented factories among the entire industries. Because of its heavily dependence on highly advanced control technologies, there have been huge research and development done on utilizing 乬big data乭 collected from equipment and sensors through local area network. Semiconductor industry spearheads other industries in 乬big data乭 and Industry 4.0. ISSM 2016 will features 乬big data乭 as one of the highlighted keywords and reviews its application and solutions in semiconductor manufacturing. The unique concept of combining 乬big data乭, artificial intelligence, and machine learning for semiconductor manufacturing will be discussed. The highlighted session provides perfect understandings about 乬big data乭 to not only semiconductor industries, but also to other industries.
Topics may includes丗
-Big Data Application
-Big Data and Sensing Technology
-Big Data and Artificial Intelligence
3D-Architecture and Modules
Topics may includes丗
-Technology for Wafer on Wafer
-Technology for FOWLP (Fan Out Wafer Level Package)
-Technology for Camera Module
-Technology for MEMS and Sensors
-Technology for WiFi and Bluetooth modules
Production Innovation in 200-mm Fabs
As a production platform for emerging IoT devices, an effective usage of 200 mm facilities has been paid attention. To strengthen device competitiveness, it is essential to pursue economics in 200 mm fabs and to boost productivity. Toward efficient fabs, many strategies and issues of capital equipment will be discussed, including effective usage of 200 mm fabs including usage of foundries, ideas for higher productivity with effective cost, usage of second-hand facilities.
Topics may includes丗
-Directions and strategies for effective fab usage
-Methodologies, ideas, and case studies for higher productivity with cost effectiveness
-Directions and issues of capital investment, and re-use directions of second-hand equipment